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Inspired by: FP7 » Handling of thermal management of intricate layered electronic assemblies

version: 1 / created: 2009-12-31
id: #633 / version id: #633
mode: VIEW

Originally submitted by: Martin Fatun
List of all contributors by versions (mouse over)
Last changed by: Martin Fatun
WI-WE status:
submitted unpublished archived

Source of inspiration

European Commission Framework Programme for RTD (FP7)

Theme/activity of inspiration

Theme 3 - ICT - Information & communication technologies

Sub-theme/area of inspiration

Components, systems, engineering

Optional reference/s to FP7 project/s

Use the following format: Project Acronym (Project Reference No.). Use commas if more than one project is associated to this Wild Card, for example: ALFA-BIRD (213266), SAFAR (213374), LAPCAT-II (211485)
NANOPACK (216176)

Headline

(max. 9 words)

Handling of thermal management of intricate layered electronic assemblies

Description

(approx. 150 words)
Please describe the Wild Card (approx. 150 words)
New technologies and materials for low thermal resistance interfaces and electrical interconnects have been discovered, which enable to eliminate obstacles with heat in intricate layered electronic assemblies. This technology makes possible to produce more integrated and more efficient electronic applications e.g. for hybrid vehicles and power supplies. Improved thermal management and integration densities for these applications will also be important to improve energy and manufacturing efficiency and component reliability.

Keywords

ICT, nanomaterials, nanotechnologies, thermal resistance, electronic assemblies

Mini-description

(max. 250 characters)

New technologies and materials for low thermal resistance interfaces and electrical interconnects eliminate obstacles with heat in intricate layered electronic assemblies.

Likelihood

Closest timeframe for at least 50% likelihood
Please use one of the following options:
now-2025